Overview
Thin films are essential components in modern materials science and technology, enabling applications ranging from semiconductor devices to protective coatings. Our research focuses on advanced deposition techniques that provide precise control over film thickness, composition, and microstructure at the nanoscale level.
Deposition Methods
- Chemical Vapor Deposition (CVD): Involves chemical reactions of gaseous precursors to form solid films on substrates, enabling high-quality coatings with uniform thickness and excellent conformal coverage
- Atomic Layer Deposition (ALD): Provides atomic-level control through sequential self-limiting surface reactions, ideal for precise thickness control in nanoscale applications
- Sputtering: Uses energetic particles to eject material from a target source, allowing deposition of a wide range of materials with good adhesion and uniformity
Technical Details
Our thin film research encompasses both fundamental studies of growth mechanisms and applied research for device integration. We utilize in-situ characterization techniques to monitor film growth in real-time, enabling optimization of deposition parameters for specific applications.
// Example ALD process simulation
const simulateALD = (cycles, growthRate) => {
const thickness = cycles * growthRate; // Angstroms
const uniformity = 0.98; // 98% uniformity
return {
thickness: thickness,
uniformity: uniformity,
depositionRate: growthRate
};
};
Applications
- Semiconductor Devices: Gate dielectrics and barrier layers in integrated circuits
- Optics: Anti-reflective coatings and optical filters
- Energy: Photovoltaic cells and battery electrodes
- Biomedical: Biocompatible coatings and drug delivery systems
Research Focus
- Growth Mechanisms: Understanding nucleation and growth kinetics
- Interface Engineering: Controlling film-substrate interactions
- Multilayer Structures: Designing complex heterostructures
- In-Situ Characterization: Real-time monitoring of deposition processes
Equipment & Facilities
- CVD Systems: Hot-wall and cold-wall reactors for various precursors
- ALD Systems: Thermal and plasma-enhanced deposition chambers
- Sputtering Systems: Magnetron and ion beam sputtering tools
- Characterization: AFM, XRD, XPS, and spectroscopic ellipsometry